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Publisher: Emerald Group Publishing Limited

Volume 30, Number 4, 2004
Special Issue: Substrate technology

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High performance epoxy copper clad laminate
pp. 16-19(4)
Author: Kehong, Fang

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High-performance substrate from new epoxy resin and enhanced copper foil
pp. 20-26(7)
Authors: Valette, Ludovic; Wiechmann, Rudolf

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An innovative "ChemicalVia" process for the production of high density interconnect printed circuit boards
pp. 27-33(7)
Authors: Silva, Vitor da; Oliveira, Rui de; Watts, David; van der Bij, Erik

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What share of the global upturn can Europe retain?
pp. 52-55(4)
Author: Friedrichkeit, Hans J

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