ISSN 0305-6120 (Print)
Publisher: Emerald Group Publishing Limited
Effects of conductor surface condition on signal integrity
Bayes, Martin; Horn, Al
Modified mixed metal oxide coated anodes for reduced additive consumption in base metal plating baths
Menard, S.; Wurm, J.
A new phase for vapour-phase ‐ an overview of the current status of vapour phase technology for soldering and related applications
Micro via filling plating technology for IC substrate applications
Yeh, Cheng-Ching; Lan, Kuo-Hsing; Dow, Wei-Ping; Hsu, Jui-Hsia; Lee, Cliff; Hsu, Chih-Hao; Lee, Ken; Chen, Jordan; Lu, Philip
A novel copper electroplating formula for laser-drilled micro via and through hole filling
Dow, Wei-Ping; Chen, Hsiang-Hao
Development of an electroless nickel immersion gold process for PCB final finishes
Kwok, R.W.M.; Chan, K.C.M.; Bayes, M.W.
UK PCB Industry 1997 to 2003
Reed, Fiona M.; Webb, D. Patrick; Walsh, Kathryn; Carpineta, Paride
Sustainable technologies for the regeneration of acidic tin stripping solutions used in PCB fabrication