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Publisher: Emerald Group Publishing Limited

Volume 30, Number 3, 2004

Effects of conductor surface condition on signal integrity
pp. 11-16(6)
Authors: Bayes, Martin; Horn, Al

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Micro via filling plating technology for IC substrate applications
pp. 26-32(7)
Authors: Yeh, Cheng-Ching; Lan, Kuo-Hsing; Dow, Wei-Ping; Hsu, Jui-Hsia; Lee, Cliff; Hsu, Chih-Hao; Lee, Ken; Chen, Jordan; Lu, Philip

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Development of an electroless nickel immersion gold process for PCB final finishes
pp. 37-42(6)
Authors: Kwok, R.W.M.; Chan, K.C.M.; Bayes, M.W.

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UK PCB Industry 1997 to 2003
pp. 43-50(8)
Authors: Reed, Fiona M.; Webb, D. Patrick; Walsh, Kathryn; Carpineta, Paride

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