ISSN 0305-6120 (Print)
Publisher: Emerald Group Publishing Limited
Impedance modelling on multiple dielectric builds pp. 12-19(8) Authors: Gaudion, Martyn; Staniforth, J Alan
Preventing whiskers in electrodeposited tin for semiconductor lead frame applications pp. 20-24(5) Authors: Whitlaw, Keith; Egli, André; Toben, Mike
Aqueous base compatible waveguide materials for optical interconnect applications pp. 25-29(5) Authors: Shelnut, Jim; Moynihan, Matt; Little, Luke; Pugliano, Nick; Sicard, Bruno; Zheng, Henry; Ho, Tuan; Allen, Craig; Khanarian, Garo; Pawlowski, Nathan
Alternative surface finishes - options and environmental considerations pp. 30-33(4) Author: Kellner, Rod
Questions concerning the migration to lead-free solder pp. 34-40(7) Authors: Ciocci, Richard; Pecht, Michael
End-of-life electronics legislation - an industry perspective pp. 41-45(5) Author: Goosey, Martin
Assessing lead-free intellectual property pp. 46-51(6) Authors: Casey, Paul; Pecht, Michael
Reaching out? - an overview of the European Commission's proposed chemicals policy pp. 52-53(2) Author: Geraghty, Kate
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