Process development for PWB compatible embedded capacitors
This paper addresses materials and processes for printed wiring board compatible embedded capacitors using polymer/ceramic nanocomposites and hydrothermal barium titanate. Polymers allow low temperature fabrication appropriate to the board (MCM-L) technology. The lower dielectric constants of the commercially available polymers can be greatly compensated by incorporating higher permittivity ceramic fillers. Materials requirements for higher capacitance density (>30 nF/cm2) have been addressed through implementation of a novel low-temperature processable hydrothermal barium titanate film on a patterned titanium foil laminated to the PWB. Application of hydrothermal grown barium titanate is currently being evaluated using a multi-layer system-on-package demonstration.
Keywords: Assembly; Capacitors; Printed Circuit Boards
Document Type: Research Article
Publication date: 01 January 2004
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