ISSN 0305-6120 (Print)
Publisher: Emerald Group Publishing Limited
Finite element modeling to analyze durability of BGA/CSP connections during thermal shock pp. 8-12(5) Authors: Khan, Subhotosh; Molligan, Dan J
The use of statistical experimental design for PCB process optimisation pp. 12-15(4) Author: Albin, David
Low cost HDI multilayers - the power mesh architecture pp. 16-21(6) Author: Holden, Happy
Integrated passives in advanced printed wiring boards pp. 22-25(4) Authors: O'Reilly, Stephen; Duffy, Maeve; O'Donnell, Terence; McCloskey, Paul; Mathúna, Seán Cian Ó
Asia: the growth engine for the world electronics industry over the next 20 years pp. 26-30(5) Author: Chiang, Shiuh-Kao
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