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Publisher: Emerald Group Publishing Limited

Volume 27, Number 2, 2001

New halogen-free materials for PWB, HDI and advanced package substrate
pp. 7-11(5)
Authors: Murai, Hikari; Takeda, Yoshiyuki; Takano, Nozomu; Ikeda, Ken


Development of a new, more efficient and environmentally friendly method of producing high density interconnects - the "PRIME" process
pp. 12-16(5)
Authors: Albin, David; Rames, Jean-Claude; Dietel, Claudia; Lenfert, Kai; Rossi, Stephanie; Starkey, David; Down, Joel; Pineda, Ricard; Sardon, Juan Carlos; Goosey, Martin; Graves, John; Bains, Narinder; Cristoph, Frank; Smeets, Frank; Gilen, Willy


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