Skip to main content
padlock icon - secure page this page is secure

Publisher: Emerald Group Publishing Limited

Volume 27, Number 2, 2001

New halogen-free materials for PWB, HDI and advanced package substrate
pp. 7-11(5)
Authors: Murai, Hikari; Takeda, Yoshiyuki; Takano, Nozomu; Ikeda, Ken

Favourites:
ADD

Development of a new, more efficient and environmentally friendly method of producing high density interconnects - the "PRIME" process
pp. 12-16(5)
Authors: Albin, David; Rames, Jean-Claude; Dietel, Claudia; Lenfert, Kai; Rossi, Stephanie; Starkey, David; Down, Joel; Pineda, Ricard; Sardon, Juan Carlos; Goosey, Martin; Graves, John; Bains, Narinder; Cristoph, Frank; Smeets, Frank; Gilen, Willy

Favourites:
ADD
Favourites:
ADD

  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
X
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more