ISSN 0305-6120 (Print)
Publisher: Emerald Group Publishing Limited
Internet commentary pp. i-i(1)
PCIF/ACeM Conference "Complete Electronic Packaging Solutions" pp. i-i(1)
Conference programme for EPC'2000 MECC, Maastricht, The Netherlands, 4-6 October, 2000 pp. i-i(1)
Dual threshold option from Lloyd Doyle pp. i-i(1)
Merger but not an acquisition pp. i-i(1)
UK leads Europe in training PCB designers pp. ii-ii(1)
International Circuit Buyers Forum merges with EMSworld pp. ii-ii(1)
Park/Nelco announces new laser drillable prepreg series pp. ii-ii(1)
Martin Barlow pp. ii-ii(1)
CEMA pp. iii-iii(1)
electronica 2000 – continued growth for leading electronics fair pp. iii-iii(1)
Orbotech introduces Vision-300AP(TM) AOI series pp. iii-iii(1)
IPC. IPC-2615: the definitive standard on printed board dimensions and tolerances pp. iv-iv(1)
CEMEX merges with Nepcon UK pp. iv-iv(1)
BPA's new PCB information service pp. iv-iv(1)
IPC. IPC committee addresses e-commerce pp. v-v(1)
International diary pp. v-v(1)
Excellon release full range 170K RPM spindle pp. v-v(1)
IPC. World production of PWBs and flex circuits rose in 1999 pp. vi-vi(1)
New Chemetall process gives precise component positioning on circuit boards pp. vi-vi(1)
Protonique has moved pp. vii-vii(1)
Rogers to manufacture and expand line of liquid photoimageable covercoats pp. vii-vii(1)
Multek expands PCB fabrication capabilities in Guadalajara, Mexico pp. viii-viii(1)
Excellon announces: electric field sensing depth control drilling pp. viii-viii(1)
New agency agreements at Lloyd Doyle pp. ix-ix(1)
Defoamant HP 5911 improves solder resist efficiency pp. ix-ix(1)
Innoveda and PADS software announce merger agreement pp. x-x(1)
New pressure indicating film is 50 percent more accurate pp. x-x(1)
First for Circast pp. xi-xi(1)
McCAD EDA forges ahead with Trailblazer pp. xi-xi(1)
Enthone-OMI fully acquires Nihon LPW Corporation pp. xii-xii(1)
Excellon Automation introduces exclusive large format, thick panel drilling pp. xii-xii(1)
Excellon Automation and PhotoMachining inc. announces technology sharing agreement in laser micro machining pp. xiii-xiii(1)
New series of twin pack solder resists from Lackwerke Peters pp. xiii-xiii(1)
CREO Ltd rises $13 million for expansion of international marketing and service infrastructure pp. xiv-xiv(1)
ECT redesigns 9098 PCB tester with new features for challenging densities pp. xiv-xiv(1)
DDi to acquire MCM Electronics pp. xv-xv(1)
Sanmina and Hadco agree to merge in a $1.3 billion transaction pp. xvi-xvi(1)
Labtech increases mixed-dielectric capacity pp. xvii-xvii(1)
Former performance Polymers Division of Ciba Specialty Chemicals becomes independent company pp. xviii-xviii(1)
Agreement to build strength in laser micro machining arena pp. xix-xix(1)
PCB manufacturer goes green pp. xx-xx(1)
Ruwel opens two new plants pp. xxi-xxi(1)
Leicester circuits installs first Argus double-sided airspray line in the UK pp. xxii-xxii(1)
Hadco Corporation releases second quarter results pp. xxiii-xxiii(1)
Labtech extends presence in USA pp. xxiv-xxiv(1)
DDi Corp. announces multiple purchases of CREO's thermal direct imaging system pp. xxv-xxv(1)
New apppointment at Lloyd Doyle pp. xxvi-xxvi(1)
MV Technology announces the appointment of Dr Malachy Rice pp. xxvii-xxvii(1)
Park Electrochemical Corp. announces election of Ronald F. Ostrow as new director pp. xxviii-xxviii(1)
Richard G. Fanelli, president and CEO of Enthone-OMI Inc. announces retirement pp. xxix-xxix(1)
Eidschun appoint new general manager pp. xxx-xxx(1)
LAMAR UK appoints technical sales manager for South-East pp. xxxi-xxxi(1)
An overview of the global electronic chemicals market pp. xxxii-xxxii(1)
New survey provides vital information for buyers pp. xxxiii-xxxiii(1)
Metallurgy and performance of electrodeposited copper for flexible circuits pp. 7-14(8) Authors: Merchant, H.D.; Wang, J.T.; Giannuzzi, L.A.; Liu, Y.L.
Trends in HDI flex pp. 15-16(2) Author: Vardaman, E. Jan
New technologies for electrical testing: PWB cost impact pp. 17-21(5) Author: Vaucher, Christophe
Predicting HDI design density pp. 22-25(4) Authors: Holden, Happy; Charbonneau, Richard
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