ISSN 0305-6120 (Print)
Publisher: Emerald Group Publishing Limited
Calculation of PCB track impedance pp. 6-10(5) Authors: Burkhardt, Andrew J; Gregg, Christopher S; Staniforth, J Alan
Laser (UV) microvia application in cellular technology pp. 11-15(5) Authors: Raman, Sudhakar; Jeong, Jae Hun; Kim, Sang Jin; Sun, Ben; Park, Keon-Yang
Utilizing thermal fatigue testing to differentiate the performance of epoxy materials at various glass transition temperature levels pp. 16-18(3) Author: Reutzel, Kathleen M
FLINT - fine line interconnect - project: development of technologies for the production of HDI-boards pp. 19-21(3) Authors: Griesinger, Andreas; Guenther, Bernd
Thermal reliability of high density interconnects utilizing microvias and standard through-hole technologies pp. 22-26(5) Authors: Young, Todd; Carano, Mike; Polakovic, Frank
An accurate method for measuring the dielectric constant of printed wiring board materials pp. 27-32(6) Author: Paulter, N.G.
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