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Publisher: Emerald Group Publishing Limited

Volume 25, Number 3, 1999

Conductive filament formation failure in a printed circuit board
pp. 6-8(3)
Authors: Rogers, Keith; Hillman, Craig; Pecht, Michael; Nachbor, Suzanne

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Experimental investigation of 355nm Nd:YAG laser ablation of RCCR in PCB
pp. 13-17(5)
Authors: Yung, Winco K.C.; Liu, J.S.; Man, H.C.

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Gold and aluminum wire bonding to palladium surface finishes
pp. 23-27(5)
Authors: Fan, Chonglun; Abys, Joseph A; Blair, Alan

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Solder failure mechanisms in single-sided insertion-mount printed wiring boards
pp. 28-38(11)
Authors: Hillman, C; Rogers, K; Dasgupta, A; Pecht, M; Dusek, R; Lorence, B

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