ISSN 0305-6120 (Print)
Publisher: Emerald Group Publishing Limited
Flexible circuitry - technology background and important fundamental issues pp. 6-10(5) Author: Fjelstad, Joseph
High volume, low cost flip chip assembly on polyester flex pp. 11-17(7) Authors: Gilleo, Ken; Boyes, Bob; Corbett, Steve; Larson, Gary; Price, Dave
Evaluation of Ni/Pd/Au as an alternative metal finish on PCB pp. 18-26(9) Authors: Mei, Zequn; Eslambolchi, Ali
Thermal cycle reliability of solder joints to alternate plating finishes pp. 27-30(4) Authors: Johnson, R Wayne; Wang, Vicky; Palmer, Michael
Optimizing BGA to PCB interconnections using multi-depth laser drilled blind vias-in-pad pp. 31-34(4) Authors: Burgess, Larry W; Pauri, Fabrizio
Limits of copper plating in high aspect ratio microvias pp. 35-40(6) Authors: Castaldi, Steve; Fritz, Dennis; Schaeffer, Ron
Design, analysis and measurement of the cost-effective substrate of a plastic ball grid array package - NuBGA pp. 41-48(8) Authors: Lau, John H; Chen, Tony; Chou, Tai-Yu
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