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Publisher: Emerald Group Publishing Limited

Volume 25, Number 1, 1999

Reliability comparison of different surface finishes on copper
pp. 25-29(5)
Authors: Yee, Shelgon; Ladhar, Harjinder

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A unique electroplating tin chemistry
pp. 30-37(8)
Authors: Zhang, Yun; Abys, Joseph A

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18 μm electrodeposited copper foil for flex fatigue applications
pp. 38-46(9)
Authors: Merchant, Harish D; Jr, Melvin G Minor; Clouser, Sid J; Leonard, Dan T

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A new small CTE system from COPNA resin/E-glass fabrics
pp. 47-54(8)
Authors: Nawa, Kazunari; Ohkita, Masakazu

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An understanding of the structure and geography of the subcontract PCB industry in the UK
pp. 55-58(4)
Authors: Hughes, Cy; Williams, David J; Edwards, Terry

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