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Publisher: Emerald Group Publishing Limited

Volume 24, Number 3, 1998

A low-cost solder-bumped chip scale package -NuCSP
pp. 11-25(15)
Authors: Lau, John H; Chang, Chris; Chen, Tony; Cheng, David; Lao, Eric

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PCB presentation
pp. 32-33(2)
Author: Cawthray, David

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Characterization of a non-woven randomly dispersed short fiber laminate
pp. 34-37(4)
Authors: Pecht, Michael; Rogers, Keith; Fowler, Andre

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