ISSN 0305-6120 (Print)
Publisher: Emerald Group Publishing Limited
Sequential Experimental Study and Optimisation of an Acid Copper Pattern Plating Process pp. 7-9(3) Author: Poon, G K K
Drum Side Treated Foil: Advanced Copper Foil Technology for Multilayer Printed Circuit Board Applications pp. 10-13(4) Author: Bergum, E J
MID Interconnection Considerations* pp. 14-17(4) Authors: van Alst,, G; van Dijk, P; Meijl, F van
A Newly Developed System for Small Annular Ring Formation * pp. 22-26(5) Authors: Masaoka, K; Tanaka, Y; Kobayashi, H
The Contamination Audit - A Vital Tool For Yield Improvement pp. 23-25(3) Author: Hamilton, S
Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting, and Vibration Conditions pp. 27-32(6) Authors: Lau, J; Gratalo, K; Schneider, E; Marcotte, T; Baker, T
Electrochemical Migration in Multichip Modules* pp. 67-70(4) Authors: B.Rudra; Li**, M J; Pecht**, M; Jennings***, D
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