Skip to main content
padlock icon - secure page this page is secure
Home / Circuit World, Volume 22, Number 1

Drum Side Treated Foil: Advanced Copper Foil Technology for Multilayer Printed Circuit Board Applications

Buy Article:

$40.56 + tax (Refund Policy)

Author: Bergum, E J

Source: Circuit World, Volume 22, Number 1, 1996, pp. 10-13(4)

Publisher: Emerald Group Publishing Limited

No Abstract.
No Reference information available - sign in for access.
No Citation information available - sign in for access.
No Supplementary Data.
No Article Media
No Metrics

Keywords: Copper Plating; Foil; Printed Circuit Boards

Document Type: Research Article

Publication date: January 1, 1996

Share Content

  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
X
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more