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Publisher: Emerald Group Publishing Limited

Volume 22, Number 1, 1996

MID Interconnection Considerations*
pp. 14-17(4)
Authors: van Alst,, G; van Dijk, P; Meijl, F van

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A Newly Developed System for Small Annular Ring Formation *
pp. 22-26(5)
Authors: Masaoka, K; Tanaka, Y; Kobayashi, H

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Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting, and Vibration Conditions
pp. 27-32(6)
Authors: Lau, J; Gratalo, K; Schneider, E; Marcotte, T; Baker, T

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Electrochemical Migration in Multichip Modules*
pp. 67-70(4)
Authors: B.Rudra; Li**, M J; Pecht**, M; Jennings***, D

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