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Open Access Interconnections for Thick Film Circuits

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A complete range of noble metal screen printing inks for thick film circuits has been developed that can be co-fired within the same time-temperature cycle with the object of simplifying and reducing the cost of circuit production. The resistor compositions have been described earlier; this article outlines the development of the conductor inks in the range.
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Document Type: Research Article

Publication date: July 1, 1969

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