Skip to main content
padlock icon - secure page this page is secure

Open Access Interconnections for Thick Film Circuits

Download Article:
 Download
(HTML 24.7 kb)
 
or
 Download
(PDF 337.7 kb)
 
A complete range of noble metal screen printing inks for thick film circuits has been developed that can be co-fired within the same time-temperature cycle with the object of simplifying and reducing the cost of circuit production. The resistor compositions have been described earlier; this article outlines the development of the conductor inks in the range.
No References for this article.
No Supplementary Data.
No Article Media
No Metrics

Document Type: Research Article

Publication date: July 1, 1969

More about this publication?
  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
X
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more