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Interconnections for Thick Film Circuits
A complete range of noble metal screen printing inks for thick film circuits has been developed that can be co-fired within the same time-temperature cycle with the object of simplifying and reducing the cost of circuit production. The resistor compositions have been described earlier;
this article outlines the development of the conductor inks in the range.
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Document Type: Research Article
Publication date: July 1, 1969
Johnson Matthey's journal of research on the platinum group metals and developments in their application in industry from 1957-2014. It has now been renamed the Johnson Matthey Technology Review
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