Skip to main content
padlock icon - secure page this page is secure

The impact of cupric ion on thermo‐oxidative degradation of chitosan

The full text article is not available for purchase.

The publisher only permits individual articles to be downloaded by subscribers.

The thermal degradation of chitosan and chitosan–cupric ion compounds in air was studied using thermogravimetric and differential thermal analyses in the temperature range 30–600 °C. The impact of cupric ion on the thermo‐oxidative degradation of chitosan was investigated. Fourier transform infrared and X‐ray diffraction analyses were utilized to determine the microstructure of the chitosan–cupric ion compounds. Kinetic parameters such as activation energy, pre‐exponential factor, Gibbs energy, and enthalpy and entropy of activation were determined using the Coats–Redfern equation. The results show that the thermo‐oxidative degradation of chitosan and chitosan–cupric ion compounds is a two‐stage reaction. The impact of cupric ion on the thermo‐oxidative degradation of chitosan is significant, and all thermodynamic parameters indicate that the thermo‐oxidative degradation of chitosan and chitosan–cupric ion compounds is a non‐spontaneous process and proceeds via a mechanism involving nucleation and growth, with an Avrami–Erofeev function (A 4) with the integral form [−ln(1 − α)]4. Copyright © 2010 Society of Chemical Industry
No References
No Citations
No Supplementary Data
No Article Media
No Metrics

Keywords: chitosan; cupric ion; differential thermal analysis; thermogravimetric analysis; thermo‐oxidative degradation

Document Type: Research Article

Publication date: August 1, 2010

More about this publication?
  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
X
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more