Skip to main content
padlock icon - secure page this page is secure

Nanocomposites based on liquid‐crystalline epoxy–clay: synthesis and morphology

The full text article is not available for purchase.

The publisher only permits individual articles to be downloaded by subscribers.

Liquid‐crystalline epoxy–organoclay nanocomposites were synthesized based on two different liquid‐crystalline epoxy monomers, 4, 4′‐diglycidyloxybiphenyl (BP) and hydroquinone bis(4‐epoxypropylbenzoate) (HB). The X‐ray diffraction patterns of BP–organoclay (93A) hybrids indicate that BP diffuses into the organoclay layers and increases d‐spacing from 2.3 to 3.7 nm either in a solvent or in the melting state. The dynamic differential scanning calorimetry results indicate that the alkylammonium ion in the clay gallery catalyzes the epoxy ring‐opening reaction with a diamine curing agent. The fast intergallery polymerization forms the exfoliated nanocomposite if the content of organoclay is below 2 %. But an intercalated nanocomposite is obtained with an increase of organoclay to 10 %. The nanocomposite with 5 % of organoclay is a mixture of the two types. Polarizing optical microscopy photographs of the cured products showed that the liquid‐crystalline phase is formed with or without organoclay. Copyright © 2005 Society of Chemical Industry
No References
No Citations
No Supplementary Data
No Article Media
No Metrics

Keywords: liquid‐crystalline epoxy; nanocomposite; organoclay

Document Type: Research Article

Affiliations: 1: Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou 510650, China 2: Sun Yat-Sen (Zhongshan) University, Guangzhou 510275, China

Publication date: August 1, 2005

More about this publication?
  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more