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Preparation and thermal properties of bismaleimide blends based on hydroxyphenyl maleimide

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N‐(4‐hydroxyphenyl)maleimide was melt‐blended with the glycidyl ether of bisphenol‐A and various mole percentages of 4, 4′‐(diaminodiphenylsulfone) bismaleimide. The cure behaviour of the resins was evaluated by differential scanning calorimetry (DSC) and dynamic mechanical thermal analysis (DMTA). The blends showed distinct reductions in the onset of cure (T o) and peak exothermic (T exo) temperatures. The blends cured at low temperatures exhibited glass transition temperatures (T gs) higher than the cure temperatures. The cured blends showed high moduli, glass transition temperatures in excess of 250 °C and good thermal stabilities up to 400 °C. Copyright © 2005 Society of Chemical Industry
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Keywords: bismaleimide; blends; epoxy resin; thermal properties

Document Type: Research Article

Affiliations: Organic Coatings and Polymers Division, Indian Institute of Chemical Technology, Tarnaka, Hyderabad 500007, India

Publication date: August 1, 2005

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