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Application of inkjet printing for 3D integration

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Inkjet printing is an attractive deposition tool to complement the traditional processing methods used in microelectronics integration. Its maskless, digital and non-contact nature provides many generic benefits, such as savings in processing steps and material usage, production flexibility and scalability to large areas. In addition, inkjet printing can be utilized in the integration of e.g.silicon and polymer or paper based systems, such as for the new wave of hybrid large-area, flexible devices, which are out of the scope of traditional clean room processing.

In this paper, we study the process of metallization of a Through-Silicon Via hole (TSV) by inkjet deposition. We describe the process of sample preparation and characterization. We finally demonstrate the creation of a fully inkjet printed 3D electrical interconnection using a Kelvin TSV test structure.
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Document Type: Research Article

Publication date: January 1, 2015

More about this publication?
  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

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