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Publisher: Elsevier

Volume 30, Number 1, 1998

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Thermal-mechanical interface crack behaviour of a surface mount solder joint
pp. 19-30(12)
Authors: Wu, C. M. L.; Lai, J. K. L.; Wu, Y.-L.

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Design-of-experiment methods for computational parametric studies in electronic packaging
pp. 125-146(22)
Authors: Dasgupta, A.; Pecht, M. G.; Mathieu, B.

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