Active and Passive Electronic Components

The Use of the Non-Contacting Temperature Measuring Techniques in the Early Detection of Hidden Faults in Electronic Components
pp. 197-201(5)
Author: P. Trägner

Noise Investigations on Thick Film Resistors
pp. 203-207(5)
Authors: G. Wollitzer; A. Ambrozy

Analysis of Thin Film Fire Sensors
pp. 209-214(6)
Authors: Zs. Illyefalvi-Vitéz; G. Zentai

Methods of Checking Printed Circuits
pp. 215-217(3)
Authors: J. Pinkola; P. Bánlaki; I. Hajdu; E. Tóth

Examination of Thick-Films Using Modern Surface Analytical Techniques
pp. 219-223(5)
Authors: G. Ripka; G. Harsányi

Usage of Sims and Auger Test Methods in the Production of Multilayer Printed Circuit Boards
pp. 225-229(5)
Authors: J. Pinkola; I. Hajdu; P. Banlaki; E. Toth

Active Trimming of Hybrid Integrated Circuits
pp. 231-235(5)
Authors: P. Krémer; P. Németh

Scratch-Profiles Study in Thin Films Using SEM and EDS
pp. 237-241(5)
Authors: E. Hajtó; G. Konczos; L. Pogány; M. El-Shabasy; B. Szikora

Inaccuracies of Measuring Methods and Their Influence on the Regression Function
pp. 243-247(5)
Author: W. Sauer

Announcement
pp. 249-250(2)

Conference Diary
pp. 251-253(3)