Skip to main content
padlock icon - secure page this page is secure

Utilizing the Cold Sintering Process for Flexible–Printable Electroceramic Device Fabrication

Buy Article:

$52.00 + tax (Refund Policy)

Conventional thermal sintering of ceramics is generally accomplished at high temperatures in kilns or furnaces. We have recently developed a procedure where the sintering of a ceramic can take place at temperatures below 200°C, using aqueous solutions as transient solvents to control dissolution and precipitation and enable densification (i.e., sintering). We have named this approach as the “Cold Sintering Process” because of the drastic reduction in sintering temperature and time relative to the conventional thermal process. In this study, we fabricate basic monolithic capacitor array structures using a ceramic paste that is printed on nickel foils and polymer sheets, with silver electrodes. The sintered capacitors, using a dielectric Lithium Molybdenum Oxide ceramic, were then cold sintered and tested for capacitance, loss, and microstructural development. Simple structures demonstrate that this approach could provide a cost‐effective strategy to print and densify different materials such as ceramics, polymers, and metals on the same substrate to obtain functional circuitry.
No References
No Citations
No Supplementary Data
No Article Media
No Metrics

Keywords: dielectric materials/properties; inks; low temperature; processing; sinter/sintering

Document Type: Research Article

Publication date: October 1, 2016

  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
X
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more