Skip to main content
padlock icon - secure page this page is secure

Electrophoretic Deposition of Ti3SiC2 and Texture Development in a Strong Magnetic Field

Buy Article:

$52.00 + tax (Refund Policy)

In this study,we have shown the applicability of electrophoretic deposition (EPD) for shape‐forming in Ti3SiC2—a representative MAX phase; and viability of texture development thereof by application of a strong magnetic field (12 T). The dispersion characteristics of Ti3SiC2 suspension were investigated in terms of surface charge, rheological measurement, and adsorption study. Polyethyleneimine has been used as dispersant to stabilize the suspension. It was found that the iso‐electric point (IEP) of Ti3SiC2 powder was pHIEP ~ 4. The surface charge of powder changed in presence of the Polyethyleneimine dispersant and IEP shifted significantly towards basic pH ~ 10. The shift in IEP has been quantified in terms of ΔG 0 SP, the specific free energy of adsorption between the surface sites and the adsorbing polyelectrolyte (PEI) (The value of ΔG 0 SP obtained is −9.521 RT units). The optimized suspension parameters for EPD were determined as 10 vol% Ti3SiC2 and 1 dwb PEI in 50% ethanolic water at pH ~ 7. X‐ray diffraction analysis of the textured samples developed, revealed that the preferred orientation of Ti3SiC2 grains parallel to the magnetic field direction was along the a, b‐axis (The Lotgering orientation factors on the textured top surface and textured side surface were determined as f L(hk0) = 0.35 and f L(00l) = 0.75, respectively).
No References
No Citations
No Supplementary Data
No Article Media
No Metrics

Document Type: Research Article

Publication date: September 1, 2012

  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more