Skip to main content
padlock icon - secure page this page is secure

Low-Loss Microwave Dielectrics Using Mg2(Ti1−xSnx)O4 (x=0.01–0.09) Solid Solution

Buy Article:

$52.00 + tax (Refund Policy)

Low-loss ceramics having the chemical formula Mg2(Ti1−xSnx)O4 for x ranging from 0.01 to 0.09 have been prepared by the conventional mixed oxide route and their microwave dielectric properties have been investigated. X-ray powder diffraction patterns indicate the corundum-structured solid solutions for the prepared compounds. In addition, lattice parameters, which linearly increase from 8.4414 to 8.4441 Å with the rise of x from 0.01 to 0.09, also confirm the forming of solid solutions. By increasing x from 0.01 to 0.05, the Q×f of the specimen can be tremendously boosted from 173 000 GHz to a maximum 318 000 GHz. A fine combination of microwave dielectric properties (r∼15.57, Q×f∼318 000 GHz at 10.8 GHz, f∼−45.1 ppm/°C) was achieved for Mg2(Ti0.95Sn0.05)O4 ceramics sintered at 1390°C for 4 h. Ilmenite-structured Mg(Ti0.95Sn0.05)O3 (r∼16.67, Q×f∼275 000 GHz at 10.3 GHz, f∼−53.2 ppm/°C) was detected as a second phase. The presence of the second phase, however, would cause no significant variation in the dielectric properties of the specimen, because the second phase properties are very similar to the primary phase. These unique properties, in particular, low r and high Q×f, can be utilized as a very promising dielectric material for ultra-high-frequency applications.
No References
No Citations
No Supplementary Data
No Article Media
No Metrics

Document Type: Research Article

Affiliations: Department of Electrical Engineering, National Cheng Kung University, Tainan 70101, Taiwan

Publication date: October 1, 2009

  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
X
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more