Insight - Non-Destructive Testing and Condition Monitoring

Comment
pp. 178-180(3)
Author: Lane, C

Nikon Metrology checks power semiconductor devices in production line
pp. 181-182(2)

Index-based triangulation method for efficient generation of large three-dimensional ultrasonic C-scans
pp. 183-189(7)
Authors: Mineo, C; Riise, J; Summan, R; MacLeod, C N; Pierce, S G

A simultaneous non-destructive characterisation method for grain size and single-crystal elastic constants of cubic polycrystals from ultrasonic measurements
pp. 190-193(4)
Author: Sha, Gaofeng

Automatic classification of welding defects from ultrasonic signals using an SVM-based RBF neural network approach
pp. 194-199(6)
Authors: Chen, Yuan; Ma, Hong-Wei; Dong, Ming

Thickness determination of dual-layer coatings based on ultrasonic spectral filtering
pp. 200-205(6)
Authors: Ma, Z Y; Zhang, W; Luo, Z B; Lin, L; Krishnaswamy, S

Guided wave sensor for simple digital communication through an oil industry multi-wire cable
pp. 206-211(6)
Authors: Trane, G; Mijarez, R; Guevara, R; Baltazar, A

Crack detection using serrated columnar phased array transducers
pp. 212-219(8)
Authors: Zou, Cheng; Sun, Zhenguo; Cai, Dong; Zhang, Wenzeng; Chen, Qiang

International Diary
pp. 220-224(5)

NDT Info
pp. 225-228(4)

Product Showcase
pp. 229-231(3)

Corporate Members/Index to advertisers
pp. 232-232(1)