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Nanoscience and Nanotechnology Letters (NNL) is a multidisciplinary peer-reviewed journal consolidating nanoscale research activities in all disciplines of science, engineering and medicine into a single and unique reference source. NNL provides the means for scientists, engineers, medical experts and technocrats to publish original short research articles as communications/letters of important new scientific and technological findings, encompassing the fundamental and applied research in all disciplines of the physical sciences, engineering and medicine.

Publisher: American Scientific Publishers

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Volume 7, Number 3, March 2015

A Special Issue

A Special Issue on Thin Films 2014
pp. 167-168(2)
Authors: Fu, Richard; Sun, Lidong; Shanyong, Sam Zhang

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Review

Advances in Nanostructured Acoustic Wave Technologies for Ultraviolet Sensing
pp. 169-192(24)
Authors: Wang, S. Y.; Li, Z. J.; Zhou, X. S.; Zhao, C.; Zu, X. T.; Fu, Y. Q.

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Communications

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Analysis of Electro-Mechanical Coupling Property on Piezoelectric Nanofibers with Metal Core and Shell Using Comsol Multi-Physics
pp. 200-203(4)
Authors: Chen, Caifeng; Qian, Yonghai; Wang, Andong; Wang, Hao; Ding, Hongyan

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Dynamic Osteosynthesis from Stiff to Biological Fixation with Graded Moduli Multilayer Coatings on Magnesium Implant
pp. 209-214(6)
Authors: Peng, Cheng; Wei, Qiang; Li, Xiaoyue; Zhang, Sam; Liu, Aifeng

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Graphene Oxide Enabled Polymeric Shape Memory Composites for Enhanced Electro-Actuation
pp. 215-219(5)
Authors: Lu, Haibao; Liang, Fei; Zhu, Shipeng; Yang, Yunhua; Yao, Yongtao; Fu, Y. Q.

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Enhanced Bioactivity of Biomedical NiTi Through Surface Plasma Polymerization
pp. 220-225(6)
Authors: Liu, Xiangmei; Weng, Zhengyang; Li, Penghui; Wong, Hoi Man; Wang, Wenhao; Wu, Shuilin; Yeung, K. W. K.; Chu, Paul K.

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Effect of Titania Nano-Fillers on the Fracture Toughness and Mechanical Performance of Hybrid Sol–Gel Coatings
pp. 226-232(7)
Authors: Wei, Mengyao; Ho, Jeffrey Weng Chye; Chen, Zhong

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Enhanced Hydroxyapatite Growth and Osteogenic Activity on Polydopamine Coated Ti Implants
pp. 233-239(7)
Authors: Xiao, Xiang; Xu, Yao; Fu, Jijiang; Gao, Biao; Huo, Kaifu; Chu, Paul K.

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Study of Adhesion Strength of Electroplated Copper to Polyimide Using Different Types of Tie Layers
pp. 240-247(8)
Authors: Chen, Lin; Liao, Bin; Yu, Jingjing; Wu, Xian-Ying; Zhang, Xu; Liang, Hong; Yin, Minju

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Stress Modulation Technology for 45 nm-Gate-CMOS Strained by a Compressive SiN Film
pp. 248-251(4)
Authors: Luo, Qian; Zhao, Di; Wang, Xiangzhan; Yu, Qi; Cui, Wei; Tan, Kaizhou

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Enhanced Photocatalytic Properties of Hierarchical Microstructured TiO2 Spheres Synthesized with Titanium Powders
pp. 252-256(5)
Authors: Wang, Jinxing; Xu, Sibo; Cheng, Shifang; Miao, Bin; Hussain, Shahid; Zeng, Wen; Cao, Pin; Wang, Jing

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Study on the Corrosion Characteristics of Sputtered Barrier-Free Cu(MoN) Copper Seed Layers
pp. 257-261(5)
Authors: Wang, Chun-Chieh; Huang, Chia-Hung; Chu, Chi-Wen; Liu, Wei-Ren; Hwang, Weng-Sing; Chiu, Sung-Mao; Wei, Chia-Min

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Mechanical Property of Polyimide Nanocomposite Films with Nitrogen Doped Graphene
pp. 262-267(6)
Authors: Liu, Xiaoxu; Yin, Jinghua; Kou, Yujie; Chen, Minghua; Yuanyuan, Liu; Li, Jialong; Zhang, Nan; Lei, Yao; Wu, Zhonghua; Su, Bo

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A Titanium Dioxide Nano Film Encapsulation for Metal Orthopedic Implants in Diathermy Rehabilitation Therapy
pp. 268-271(4)
Authors: Hua, Z. K.; Tang, F.; Bai, Y. H.; Wei, B.; Xu, Y. M.; Ye, D. M.; Wang, X. J.; Chen, T.; Wang, G.

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P1dB Optimization Methodology for 130 nm SiGe BiCMOS 60 GHz Power Amplifier
pp. 272-275(4)
Authors: Wu, Wenguang; Gu, Jiangmin; Lim, Wei Meng; Yao, Feijie; Sui, Wenquan; Siek, Liter

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Study and Application of Leakage Currents in MOSFET Under Nanometer Process to Reference Circuits
pp. 281-286(6)
Authors: Xu, Zhentao; Gao, Baoling; Liu, Yang; Yu, Qi

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An 80 μW Radio Frequency Frontend Used for Wearable Receivers Designed in 180 nm Si Technology
pp. 287-291(5)
Authors: Kong, Deyu; Shi, Zhengyu; Liu, Yang; Yu, Qi

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A Picoampere-Sensitivity Readout Circuit for Nanosensor Array
pp. 292-295(4)
Authors: Wang, X. Z.; Lei, X.; Zhang, X. C.; Wu, S. Y.; Liu, C. J.; Luo, M. C.; Li, Y. D.

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