Skip to main content
padlock icon - secure page this page is secure

Open Access Effect of secondary inhibitors on material removal rate and nano-roughness of Cu chemical mechanical planarization

Download Article:
(PDF 11,587.2 kb)
We have reported chemical mechanical planarization (CMP) performance aspects of nanoscale colloidal silica based Cu CMP slurries with a focus on the interdependent effect of various slurry ingredients like inhibitor, oxidant, chelating agent, dispersant and stabilizer. The CMP performance was mainly evaluated in terms of material removal rate and nanoscale wafer surface uniformity. The use of heterocyclic organic compounds and non-ionic surfactant—as secondary inhibitors—has been explored in formulating the slurry to enhance the CMP performance. The nanoscale roughness was ascertained by using high resolution atomic force microscopy. It is concluded that the addition of the commercial surfactant Triton X-100 in the slurry plays a key role in realizing high material removal rate outcome (i.e., higher than 6000 Å/min) and fittingly low wafer surface uniformity at nanoscale. The speculative mechanism for the enhanced Cu CMP performance with respect to addition of Triton X-100 has been also proposed by using tools like X-ray photoelectron spectroscopy, high resolution atomic force microscopy and contact angle measurements.
No References for this article.
No Supplementary Data.
No Article Media
No Metrics


Document Type: Research Article

Publication date: October 1, 2016

More about this publication?
  • Materials Express is a peer-reviewed multidisciplinary journal reporting emerging researches on materials science, engineering, technology and biology. Cutting-edge researches on the synthesis, characterization, properties, and applications of a very wide range of materials are covered for broad readership; from physical sciences to life sciences. In particular, the journal aims to report advanced materials with interesting electronic, magnetic, optical, mechanical and catalytic properties for industrial applications.
  • Editorial Board
  • Information for Authors
  • Subscribe to this Title
  • Ingenta Connect is not responsible for the content or availability of external websites
  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more