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Effect of Mo Nanoparticles on the Growth Behavior of the Intermetallic Compounds Layer in Sn3.0Ag0.5Cu/Cu Solder Joints

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The reliability of solder joints, which is affected largely by the interfacial intermetallic compounds layer, is of great importance to the performance of electronic devices. In this paper, a novel composite solder with Mo nanoparticles doped in Sn3.0Ag0.5Cu solder was prepared. Solder/Cu joints were prepared using Sn3.0Ag0.5Cu solder or Mo nanoparticles reinforced solder with Cu substrates. The effect of the nanoparticles on the growth of intermetallic compounds during isothermal aging was investigated. It was found that the addition of Mo nanoparticle markedly suppressed the increase in thickness of the interfacial intermetallic compounds layer during isothermal aging. The atomic diffusion coefficients during isothermal aging in Sn3.0Ag0.5Cu solder and in the novel doped solder were determined experimentally. Mo nanoparticles were found to decrease the diffusion coefficient in the composite solder. The high specific surface area of the nanoparticles makes them easily adsorbed and hinders the diffusion of Sn and Cu atoms. This is consistent with an increase in the diffusion activation energy due to the addition of Mo nanoparticles in Sn3.0Ag0.5Cu solder.
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Keywords: Diffusion; Interface; Intermetallic Compounds; Nanoparticle; Solder Joint

Document Type: Research Article

Affiliations: Shenyang University of Technology, Shenyang 110870, China

Publication date: April 1, 2020

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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