Skip to main content
padlock icon - secure page this page is secure

Effects of Cu Opening Size on the Mechanical Properties of Epoxy-Contained Sn-58Bi Solder Joints

Buy Article:

$106.51 + tax (Refund Policy)

The effects of Cu opening size on the mechanical properties of epoxy-contained Sn-58Bi solder joints were investigated by a low-speed shear test. Eight sample types were fabricated with various Cu opening sizes and solder pastes. The Cu opening sizes of the component and substrate were 200 μm or 380 μm, respectively, and the component formed a Sn-3.0Ag-0.5Cu (SAC305) solder bump which was placed on the Sn-58Bi solder paste or epoxy Sn-58Bi solder paste printed on the substrate and then reflowed. The microstructures of the solder joints were observed using scanning electron microscopy (SEM), and the chemical compositions were analyzed by energy-dispersive X-ray spectroscopy (EDS) and electron probe X-ray micro-analyzer (EPMA). Epoxy was formed around the solder joints after the reflow process, improving the bonding strength of the epoxy-contained solder joints. Specifically, the bonding strength of the epoxy Sn-58Bi solder joints increased about 2.9 times in the 200 μm (opening size of component)/380 μm (opening size of substrate) sample. When the opening size of the component and substrate differed, a fracture occurred at the smaller opening size. On the other hand, a fracture occurred at the substrate side for the SAC305 (solder paste of component)/Sn-58Bi (solder paste of substrate) solder joints, while a fracture occurred at the interface between SAC305 and Sn-58Bi at the SAC305/epoxy Sn-58Bi solder joints for samples with the same opening size between the component and substrate.
No Reference information available - sign in for access.
No Citation information available - sign in for access.
No Supplementary Data.
No Article Media
No Metrics

Keywords: Ball-Grid Array; Cu Opening Size; Epoxy Solder; Low-Speed Shear Test; Sn-58Bi

Document Type: Research Article

Affiliations: 1: School of Advanced Materials Science and Engineering, Sungkyunkwan University, 2066 Seobu-ro, Jangan-gu Suwon, 16419, South Korea 2: SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, 2066 Seobu-ro, Jangan-gu Suwon, 16419, South Korea

Publication date: October 1, 2019

More about this publication?
  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
  • Editorial Board
  • Information for Authors
  • Subscribe to this Title
  • Terms & Conditions
  • Ingenta Connect is not responsible for the content or availability of external websites
  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more