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Oxidation and Tribological Behavior of Ti–B–C–N–Si Nanocomposite Films Deposited by Pulsed Unbalanced Magnetron Sputtering

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Quinary Ti–B–C–N–Si nanocomposite films were deposited onto AISI 304 substrates using a pulsed d.c. magnetron sputtering system. The quinary Ti–B–C–N–Si (5 at.%) film showed excellent tribological and wear properties compared with those of the Ti–B–C–N films. The steady friction coefficient of 0.151 and a wear rate of 2 × 10−6 mm3N−1m−1 were measured for the Ti–B–C–N–Si films. The oxidation behavior of Ti–B–C–N–Si nanocomposite films was systematically investigated using X-ray diffraction (XRD), and thermal analyzer with differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). It is concluded that the addition of Si into the Ti–B–C–N film improved the tribological properties and oxidation resistance of the Ti–B–C–N–Si films. The improvements are due to the formation of an amorphous SiO x phase, which plays a major role in the self-lubricant tribo-layers and oxidation barrier on the film surface or in the grain boundaries, respectively.
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Keywords: Nanocomposite; Oxidation; Ti–B–C–N–Si Films; Tribological Property

Document Type: Research Article

Affiliations: 1: Korea Institute of Industrial Technology (KITECH), Busan, 46742, South Korea 2: School of Materials Science and Engineering, Pusan National University, Busan, 46241, South Korea

Publication date: March 1, 2018

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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