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Effects of Heat Treatment on Interfacial Behavior and Bonding Strength of Surface Activated Bonding Ti–Al Laminate

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The surface activated bonding (SAB) method generally has the advantage of high bonding strength, low contact resistance, and high microstructural stability at room temperature. In this study, Ti–Al laminates were produced by surface activated bonding with aluminum and titanium foils. Heat treatment was conducted at the temperature range from 200 to 550 °C in vacuum. The bonding strength Ti–Al laminates was measured by a peel test, and the interfacial characteristics were investigated microstructural observation. The results showed that the bonding strength was the highest with heat treatment at 400 °C, microstructure observation revealed that the bonding strength of the Ti–Al laminate was influenced by the interfacial characteristics.
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Keywords: Heat Treatment; Peel Strength; Surface Activated Bonding; Ti–Al Metal Clad

Document Type: Research Article

Affiliations: 1: Department of Materials Engineering, Inha University, Incheon 22212, Republic of Korea 2: Heesung Metal, Incheon 21697, Republic of Korea 3: Global Technology Center, Samsung Electronics, Suwon 16677, Republic of Korea

Publication date: March 1, 2018

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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