Welding Silver Nanowire Junctions for Transparent Conducting Films by a Rapid Electroplating Method

A simple electrochemical method is developed in this study to weld the contact points in silver nanowire (AgNW) thin films. The AgNW thin film is first fabricated by spray coating and then submerged in a silver plating solution. By applying electrical potential over the AgNW thin films, silver ions in the plating solution are reduced into silver nanoparticles preferentially over nanowires and solder the nanomesh structures. Due to the large current density between silver nanowires, nanoparticles generated in the electroplating reaction mainly appeared at the junction. The electroplated AgNW network not only shows better conductivity with a negligible loss of transmittance, but also exhibit much better mechanical strength in the bending test.