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Thermoelectric Cooler Module with Enhanced Cooling Ability Using a Hybrid Cu Paste and a Si Substrate

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A cost-effective and cooling-enhanced thermoelectric cooler (TEC) module is proposed using a new die attachment material and a Si substrate. Although silver paste has been widely used in TEC modules, it has generally shown poor shear strength relative to the high material cost and high temperature of the sintering process. A cost-effective hybrid copper paste (HCP) material, which is composed of Ag-coated Cu flakes, solder powder, and a fluxing resin, is proposed to compensate for the weakness of silver paste. By optimizing the volumetric ratio of the Ag-coated Cu flakes, solder powder, and fluxing resin, screen printing and a curing process for the die attachment were successfully developed. A commercial Ag paste and HCP were applied to interconnect p-type and n-type TE legs with the substrate. Two types of TEC modules were fabricated using a ceramic substrate and a Si substrate. TEC with a module size of 40 mm × 40 mm were fabricated with 128 pairs of p- and n-type TE legs. In this work, the DC resistance and cooling capacity of the TEC module using HCP and a Si substrate were measured and compared with a conventional TEC module. The proposed TEC module is proved to work well with its three advantages: cost reduction, process simplification, and cooling ability.

Keywords: Cooling Ability; Hybrid Cu Paste; Thermoelectric Cooler Module

Document Type: Research Article

Affiliations: Information and Communications Core Technology Research Laboratory, Electronics and Telecommunications Research Institute, Daejeon 305-700, Korea

Publication date: December 1, 2016

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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