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Fabrication of Nanostructured Deoxidized Low-Phosphorous Copper Processed by Three-Layer Stack Accumulative Roll-Bonding

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A nanostructured deoxidized low-phosphorous copper (DLPC) was fabricated by three-layer stack accumulative roll-bonding (ARB) process. The microstructural evolution and the variation of mechanical properties with three-layer stack ARB were investigated in detail. It was found that the microstructure has been evolved from a dislocation cell structure to ultrafine grained structure as the number of ARB cycles increases. In addition, the mean spacing of grain boundaries, which was 45 μm in initial material, reduced to 2.1 μm after 1 cycle, 360 nm after 3 cycles, 250 nm after 5 cycles, then 170 nm after 7 cycles, progressively. The fraction of high-angle grain boundaries after 1-cycle ARB was no more than 0.27, but it increased with the number of ARB cycles, and became surprisingly more than 0.7 after 7-cycle ARB. The tensile strength increased with the number of ARB cycles, and then after 7 cycles it reached about 600 MPa, which is about 2.5 times higher than that of the initial material. Therefore, the three-layer stack ARB is very effective for development of ultrafine grains and high strengthening of DLPC alloy.
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Document Type: Research Article

Publication date: February 1, 2011

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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