@article {Kim:2011:1533-4880:537,
title = "High Frequency Characteristics of Printed Cu Conductive Circuit",
journal = "Journal of Nanoscience and Nanotechnology",
parent_itemid = "infobike://asp/jnn",
publishercode ="asp",
year = "2011",
volume = "11",
number = "1",
publication date ="2011-01-01T00:00:00",
pages = "537-540",
itemtype = "ARTICLE",
issn = "1533-4880",
eissn = "1533-4899",
url = "https://www.ingentaconnect.com/content/asp/jnn/2011/00000011/00000001/art00092",
doi = "doi:10.1166/jnn.2011.3160",
keyword = "RADIO FREQUENCY, S-PARAMETER, COPPER, SCREEN PRINTING, NANO-PARTICLE",
author = "Kim, Jong-Woong and Lee, Young-Chul and Kim, Kwang-Seok and Jung, Seung-Boo",
abstract = "The effects of sintering temperature on microstructural evolution and electrical characteristics of screen printed Cu patterns were observed. A commercial conducting paste containing Cu nanoparticles was screen printed onto a sodalime wafer sintered under a sintering temperature range
of 300 \textdegreeC to 450 \textdegreeC. A network analyzer and Cascade's probe system in the frequency range of 10 MHz to 20 GHz were employed to measure the S-parameters of the sintered Cu conducting patterns. From the measured S-parameters, the insertion losses in high frequencies decreased with increasing
sintering temperature due to the formation of an interparticle necking after heat treatment at high temperatures. However, oxidation of Cu nanoparticles during the sintering deteriorated the RF performance of the circuits, resulting large deviation of the S-parameters from the simulated curves.",
}