Synthesis and Performance of Colloidal Silica Nano-Abrasives with Controllable Size for Chemical Mechanical Planarization
Under the analysis of particle growth mechanism, the monodisperse colloidal silica abrasives for chemical mechanical planarization (CMP) slurry were synthesized by the modified ion-exchanged and hydrothermal step-polymerization process. After the colloidal silica with controllable size was synthesized, its microstructure, stability and CMP performance was characterized and tested by SEM, HRTEM, Zeta potential Analyzer and CMP tester. Results show that the spherical, high stable (Zeta potential: −52.8 mV) colloidal silica with controllable size was achieved. About its CMP performance, the polishing rate for silicon double-side CMP is increased to be 317 nm/min and the polished surface roughness (RMS) was reduced to 0.32 nm.
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Document Type: Research Article
Publication date: February 1, 2009
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