Finite Element Analysis of Effects of Mechanical Properties on Indentation-Induced Interfacial Delamination
Evolution of indentation-induced delamination for a bi-layer structure is studied by finite element methods with a critical tensile stress for the criterion of interfacial separation. The indenter used is a cone with a spherical tip, and both the film and the substrate are elasto-perfectly plastic, which are within the range of the selected mechanical properties. Within these conditions, the results for a hard-film-soft-substrate system show that indentation-induced delamination initiates at some distance away from the indenter and grows during the final stage of unloading process; delamination cannot be characterized by load–displacement curves, since it is not a sudden event. Delamination profiles and the indentation load–displacement curves are closely related to mechanical properties of the film and the substrate: (1) larger Young's modulus, yield stress and Poisson's ratio result in larger indentation load; (2) larger Young's modulus of film or yield stress of substrate leads to a decrease of delamination; (3) smaller Young's modulus of substrate or yield stress of film brings about a smaller delamination; (4) increasing Poisson's ratio produces a smaller delamination; (5) properties of the film and the interface have only a little effect on the indentation load–displacement curve; (6) effect of properties of substrate on the indentation load–displacement curve is prominent.
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Document Type: Research Article
Publication date: July 1, 2014
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