Large area bonding for power devices by pillar-like IMC effective dispersion control

Electronic packaging is extremely important, not least to protect the precious electronic devices inside. And these precious devices, in turn, are used to build important industrial products such as automobiles and smart grid systems, for example. It makes sense, then, that high-quality electronic packaging and the technologies used to produce it is paramount. In Japan, electronic packaging technology is known as 'Jisso' and can be defined as a key technology supporting the development of electronic devices. A team of Japanese researchers is investigating bonding methodologies, structures and materials for electronics packaging, as well as shedding light on the effect of microstructures on the mechanical properties and reliability of joints.