Search Results

Optimal wire ordering and spacing in low power semiconductor design

Authors: Gritzmann, Peter; Ritter, Michael; Zuber, Paul

Source: Mathematical Programming, Volume 121, Number 2, February 2010 , pp. 201-220(20)

Publisher: Springer

INVENTOR PRODUCTIVITY AND FIRM SIZE: EVIDENCE FROM PANEL DATA ON INVENTORS

Authors: Kim, Jinyoung; Lee, SangjoonJohn; Marschke, Gerald

Source: Pacific Economic Review, Volume 14, Number 4, October 2009 , pp. 516-531(16)

Publisher: Blackwell Publishing

Knowledge integration and vertical specialization in the semiconductor industry

Authors: Dibiaggio, Ludovic; Nasiriyar, Maryam

Source: European Management Review, Volume 6, Number 4, 2009 , pp. 265-276(12)

Publisher: Palgrave Macmillan

Nanotechnology applications in pollution sensing and degradation in agriculture: a review

Authors: Baruah, Sunandan; Dutta, Joydeep

Source: Environmental Chemistry Letters, Volume 7, Number 3, September 2009 , pp. 191-204(14)

Publisher: Springer

The impact of product architecture on supply chain integration: a case study of Nokia and Texas Instruments

Authors: Park, YoungWon; Ogawa, Koichi; Tatsumoto, Hirofumi; Hong, Paul

Source: International Journal of Services and Operations Management, Volume 5, Number 6, 26 June 2009 , pp. 787-798(12)

Publisher: Inderscience Publishers

A review on strategic capacity planning for the semiconductor manufacturing industry

Authors: Geng, Na; Jiang, Zhibin

Source: International Journal of Production Research, Volume 47, Number 13, January 2009 , pp. 3639-3655(17)

Publisher: Taylor and Francis Ltd

Technology, power and structure: consequences for US semiconductor competitiveness

Author: Kanz, John W.

Source: International Journal of Technology Management, Volume 9, Numbers 5-6, 23 May 2009 , pp. 733-756(24)

Publisher: Inderscience Publishers

The management of development projects

Author: Bowers, G.H.

Source: International Journal of Technology Management, Volume 3, Number 6, 26 May 2009 , pp. 675-684(10)

Publisher: Inderscience Publishers

Managing economic and technological competitiveness in the US semiconductor industry: short- and long-term strategies

Author: Molina, Alfonso H.

Source: International Journal of Technology Management, Volume 4, Number 2, 26 May 2009 , pp. 157-175(19)

Publisher: Inderscience Publishers

Financing expansion in an international industry: The case of electronics

Authors: Miller, Robert R.; Alic, John A.

Source: International Journal of Technology Management, Volume 1, Numbers 1-2, 27 May 2009 , pp. 101-117(17)

Publisher: Inderscience Publishers

Using data envelopment analysis (DEA) to evaluate the operational performance of the wafer fabrication industry in Taiwan

Authors: Chen, Yu-Shan; Chen, Bi-Yu

Source: Journal of Manufacturing Technology Management, Volume 20, Number 4, 2009 , pp. 475-488(14)

Publisher: Emerald Group Publishing Limited

Design of a Twins-Oval Tool in a Precise Nanostructure Reclamation of Digital Paper Displays

Author: Pa, P.S.

Source: Journal of Nanoscience and Nanotechnology, Volume 9, Number 8, August 2009 , pp. 4851-4857(7)

Publisher: American Scientific Publishers

Interface-tailored and nanoengineered polymeric materials for (opto)electronic devices

Authors: Ma, Hong; Liu, Michelle S; Jen, Alex K-Y

Source: Polymer International, Volume 58, Number 6, June 2009 , pp. 594-619(26)

Publisher: John Wiley & Sons, Ltd.

Promoting Enterprise-Led Innovation in China

Authors: Zhang, Chunlin; Zhihua Zeng, Douglas; Mako, William Peter; Seward, James

Source: Promoting Enterprise-Led Innovation in China, April 2009 , pp. 1-142(142)

Publisher: World Bank

Anion/Cation Layers at Electrified Interfaces: A Comprehensive STM, XRD and XPS Case Study

Authors: Pham, Duc T.; Keller, Hubert; Breuer, Stephan; Huemann, Sascha; Hai, Nguyen T.N.; Zoerlein, Caroline; Wandelt, Klaus; Broekmann, Peter

Source: CHIMIA International Journal for Chemistry, Volume 63, Number 3, March 2009 , pp. 115-121(7)

Publisher: Swiss Chemical Society

Team learning, top management support and new product development success

Authors: Islam, Md Zahidul; Doshi, Jason A.; Mahtab, Hanif; Ahmad, Zainal Ariffin

Source: International Journal of Managing Projects in Business, Volume 2, Number 2, 2009 , pp. 238-260(23)

Publisher: Emerald Group Publishing Limited

New Industries from New Places

Authors: Gregory, Neil; Stanley, D. Nollen; Tenev, Stoyan

Source: New Industries from New Places, March 2009 , pp. 1-255(255)

Publisher: World Bank

Strategic knowledge capabilities in Taiwan's semiconductor industry

Authors: Tseng, Chun-Yao; Pai, Da Chang

Source: International Journal of Intelligent Enterprise, Volume 1, Number 2, 2 April 2009 , pp. 139-155(17)

Publisher: Inderscience Publishers

Aspects of advanced thermal management for flip chip on low temperature cofired ceramics (LTCC)

Authors: Norén, M.; Brunner, S.; Hoffmann, C.; Salz, W.; Aichholzer, K.

Source: Soldering & Surface Mount Technology, Volume 21, Number 2, 2009 , pp. 24-27(4)

Publisher: Emerald Group Publishing Limited

Measuring Dynamic Capabilities: Practices and Performance in Semiconductor Manufacturing

Authors: Macher, Jeffrey T.; Mowery, David C.

Source: British Journal of Management, Volume 20, Supplement 1, March 2009 , pp. S41-S62(1)

Publisher: Blackwell Publishing