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55 articles with title/keywords/abstract containing aging couples

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Influence of lifestyle factors on fertility rate

Author: Crosignani, Pier Giorgio

Source: Expert Review of Obstretrics and Gynecology, Volume 4, Number 6, November 2009 , pp. 635-646(12)

Publisher: Expert Reviews

Men, Intimacy, and Eroticism

Authors: McCarthy, Barry; Thestrup, Maria

Source: The Journal of Sexual Medicine, Volume 6, Number 2, February 2009 , pp. 588-594(7)

Publisher: Blackwell Publishing

Family Changes in the Context of Lowest-Low Fertility: The Case of Japan

Author: Atoh, Makoto

Source: International Journal of Japanese Sociology, Volume 17, Number 1, November 2008 , pp. 14-29(16)

Publisher: Blackwell Publishing

Sexual Counseling in Elderly Couples

Authors: Bitzer, Johannes; Platano, Giacomo; Tschudin, Sibil; Alder, Judith

Source: The Journal of Sexual Medicine, Volume 5, Number 9, September 2008 , pp. 2027-2043(17)

Publisher: Blackwell Publishing

Changes in Support From Confidants, Children, and Friends Following Widowhood

Author: Ha, Jung-Hwa

Source: Journal of Marriage and Family, Volume 70, Number 2, May 2008 , pp. 306-318(13)

Publisher: Blackwell Publishing

Working Couples Caring for Children and Aging Parents - by Margaret B. Neal and Leslie B. Hammer

Author: Pitt-Catsouphes, Marcie

Source: Journal of Marriage and Family, Volume 70, Number 2, May 2008 , pp. 565-566(2)

Publisher: Blackwell Publishing

Recent advances in female infertility assessment and treatment

Author: Gillett, Wayne R

Source: Expert Review of Obstretrics and Gynecology, Volume 2, Number 4, July 2007 , pp. 501-513(13)

Publisher: Expert Reviews

Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates

Authors: Tsai, J.; Chang, C.; Ho, C.; Lin, Y.; Kao, C.

Source: Journal of Electronic Materials, Volume 35, Number 1, January 2006 , pp. 65-71(7)

Publisher: Springer

Cross-Interaction Between Au and Cu in Au/Sn/Cu Ternary Diffusion Couples

Authors: Chang, C.W.; Lee, Q.P.; Ho, C.E.; Kao, C.R.

Source: Journal of Electronic Materials, Volume 35, Number 2, February 2006 , pp. 366-371(6)

Publisher: Springer

Microstructure and Mechanical Properties Evolution of Intermetallics between Cu and Sn-3.5Ag Solder Doped by Ni-Co Additives

Authors: Gao, F.; Takemoto, T.; Nishikawa, H.; Komatsu, A.

Source: Journal of Electronic Materials, Volume 35, Number 5, May 2006 , pp. 905-911(7)

Publisher: Springer

Electrochemical and Spectroscopic Properties of Fly Ash-Polyaniline Matrix Nanorod Composites

Authors: Iwuoha, Emmanuel I.; Mavundla, Sipho E.; Somerset, Vernon S.; Petrik, Leslie F.; Klink, Michael J.; Sekota, Mantoa; Bakers, Priscilla

Source: Microchimica Acta, Volume 155, Numbers 3-4, October 2006 , pp. 453-458(6)

Publisher: Springer

A Dyadic Examination of Daily Health Symptoms and Emotional Well-Being in Late-Life Couples

Authors: Yorgason, Jeremy B.; Almeida, David; Neupert, Shevaun D.; Spiro, Avron; Hoffman, Lesa

Source: Family Relations, Volume 55, Number 5, December 2006 , pp. 613-624(12)

Publisher: Blackwell Publishing

Microstructure Evolution of Gold-Tin Eutectic Solder on Cu and Ni Substrates

Authors: Tsai, J.Y.; Chang, C.W.; Ho, C.E.; Lin, Y.L.; Kao, C.R.

Source: Journal of Electronic Materials, Volume 35, Number 1, January 2006 , pp. 65-71(7)

Publisher: Springer

Modeling the Precipitation Processes and Strengthening Mechanisms in a Mg-Al-(Zn) AZ91 Alloy

Authors: Hutchinson, C.R.; Nie, J.F.; Gorsse, S.

Source: Metallurgical and Materials Transactions A, Volume 36, Number 8, August 2005 , pp. 2093-2105(13)

Publisher: Springer

Exploring the impact of traumatic brain injury on the older couple: ‘Yes, but how much of it is age, I can't tell you…'

Authors: Layman, D. E.; Dijkers, M. P. J. M.; Ashman, T. A.

Source: Brain Injury, Volume 19, Number 11, October 2005 , pp. 909-923(15)

Publisher: Informa Healthcare

Compensating strategies in collaborative remembering in very old couples

Authors: JOHANSSON, N. OLOF; ANDERSSON, JAN; RÖNNBERG, JERKER

Source: Scandinavian Journal of Psychology, Volume 46, Number 4, August 2005 , pp. 349-359(11)

Publisher: Blackwell Publishing

Mechanical strength of Sn-3.5Ag-based solders and related bondings

Authors: Chuang, Chiang-Ming; Shih, Po-Cheng; Lin, Kwang-Lung

Source: Journal of Electronic Materials, Volume 33, Number 1, January 2004 , pp. 1-6(6)

Publisher: Springer

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