Search Results

Comparative Properties of Agrofiber Based Particle Boards Using Newly Developed Bonding Materials

Authors: Osman, Z.; Pizzi, A.; Alamin, I.H.

Source: Journal of Biobased Materials and Bioenergy, Volume 3, Number 3, September 2009 , pp. 275-281(7)

Publisher: American Scientific Publishers

Formulation and evaluation of ubidecarenone transdermal delivery systems

Authors: Jung, Sun Young; Kang, Eun Young; Choi, Yoon Jung; Chun, In Koo; Lee, Byung Koo; Gwak, Hye Sun

Source: Drug Development and Industrial Pharmacy, Volume 35, Number 9, September 2009 , pp. 1029-1034(6)

Publisher: Informa Healthcare

Analysis of Mixed Adhesive Bonded Joints Part II: Parametric Study

Authors: das Neves, Paulo J.C.; da Silva, Lucas F.M.; Adams, R.D.

Source: Journal of Adhesion Science and Technology, Volume 23, Number 1, 2009 , pp. 35-61(27)

Publisher: VSP, an imprint of Brill

Preparation and Properties of a Waterborne Contact Adhesive Based on Polychloroprene Latex and Styrene-Acrylate Emulsion Blend

Authors: Zhang, Kai; Shen, Hui-fang; Zhang, Xin-ya; Lan, Ren-hua; Chen, Huan-qin

Source: Journal of Adhesion Science and Technology, Volume 23, Number 1, 2009 , pp. 163-175(13)

Publisher: VSP, an imprint of Brill

A novel natural adhesive from rice bran

Authors: Wang, W.H.; Zhang, X.Q.; Li, X.P.

Source: Pigment & Resin Technology, Volume 37, Number 4, 2008 , pp. 229-233(5)

Publisher: Emerald Group Publishing Limited

Adhesives: Polymer Chemistry at Work

Authors: Arz, Christof; Dobmann, Andreas; Meincke, Olaf; Schulthess, Adrian; Schwotzer, Willi

Source: CHIMIA International Journal for Chemistry, Volume 62, Number 10, October 2008 , pp. 826-831(6)

Publisher: Swiss Chemical Society

Identification of the Strain Rate Parameters for Structural Adhesives

Authors: Fancello, E.; Goglio, L.; Stainier, L.; Vassoler, J.M.

Source: Journal of Adhesion Science and Technology, Volume 22, Number 13, 2008 , pp. 1523-1540(18)

Publisher: VSP, an imprint of Brill

Finite Deformation Elasto-Plasticity for Simulation of Strength Difference in Adhesive Materials with an Algorithm in Principal Directions

Author: Mahnken, Rolf

Source: Mechanics of Advanced Materials and Structures, Volume 15, Numbers 6-7, August 2008 , pp. 514-527(14)

Publisher: Taylor and Francis Ltd

Formulation and Evaluation of Ketorolac Transdermal Systems

Authors: Choi, Jun Shik; Cho, Young Ah; Chun, In Koo; Jung, Sun Young; Gwak, Hye Sun

Source: Drug Delivery, Volume 14, Number 2, February 2007 , pp. 69-74(6)

Publisher: Informa Healthcare

Studies on Metal-to-Metal Adhesives Based on CNSL Resins

Authors: Lubi C., Mary; Thachil, Eby Thomas

Source: Polymer-Plastics Technology and Engineering, Volume 45, Number 1, Number 1/2006 , pp. 43-48(6)

Publisher: Taylor and Francis Ltd

Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity for Flip Chip Applications

Authors: Yim, M.J.; Kim, H.J.; Paik, K.W.

Source: Journal of Electronic Materials, Volume 34, Number 8, August 2005 , pp. 1165-1171(7)

Publisher: Springer

Reliability improvement of conductive adhesives on tin (Sn) surfaces

Authors: Li, Yi; Moon, Kyoung-Sik; Wong, C.P.

Source: Journal of Adhesion Science and Technology, Volume 19, Number 16, 2005 , pp. 1427-1444(18)

Publisher: VSP, an imprint of Brill

Formulation and Characterization of Anisotropic Conductive Adhesive Paste for Microelectronics Packaging Applications

Authors: Cao, Liqiang; Li, Shiming; Lai, Zonghe; Liu, Johan

Source: Journal of Electronic Materials, Volume 34, Number 11, November 2005 , pp. 1420-1427(8)

Publisher: Springer

A statistical method for the prediction of the loop tack and the peel of PSAs from probe test measurements

Authors: Rivals, Isabelle; Personnaz, Léon; Creton, Costantino; Simal, François; Roose, Patrice; Steven van Es,

Source: Measurement Science and Technology, Volume 16, Number 10, October 2005 , pp. 2020-2029(10)

Publisher: Institute of Physics Publishing

Isotropic Conductive Adhesives with Fusible Filler Particles

Authors: Kim, Jong-Min; Yasuda, Kiyokazu; Fujimoto, Kozo

Source: Journal of Electronic Materials, Volume 33, Number 11, November 2004 , pp. 1331-1337(7)

Publisher: Springer

Stabilizing Contact Resistance of Isotropically Conductive Adhesives on Various Metal Surfaces by Incorporating Sacrificial Anode Materials

Authors: Moon, Kyoung-Sik; Liong, Silvia; Li, Haiying; Wong, C.P.

Source: Journal of Electronic Materials, Volume 33, Number 11, November 2004 , pp. 1381-1388(8)

Publisher: Springer

Recycling melamine-impregnated paper waste as board adhesives

Authors: Le Fur, X.; Galhac, M.; Zanetti, M.; Pizzi, A.

Source: Holz als Roh- und Werkstoff, Volume 62, Number 6, December 2004 , pp. 419-423(5)

Publisher: Springer

Dependance on the adhesive formulation of the upgrading of MUF particleboard adhesives and decrease of melamine content by buffer and additives

Authors: Zanetti, M.; Pizzi, A.

Source: Holz als Roh- und Werkstoff, Volume 62, Number 6, December 2004 , pp. 445-451(7)

Publisher: Springer

Applications of biopolymers and other biotechnological products in building materials

Author: Plank, Johann

Source: Applied Microbiology and Biotechnology, Volume 66, Number 1, November 2004 , pp. 1-9(9)

Publisher: Springer

The effect of hyper-branched polymers on the properties of dental composites and adhesives

Authors: H. Dodiuk-Kenig; K. Lizenboim; I. Eppelbaum; B. Zalsman; S. Kenig

Source: Journal of Adhesion Science and Technology, Volume 18, Numbers 15-16, 2004 , pp. 1723-1737(15)

Publisher: VSP, an imprint of Brill