Search Results

Microstructures formed from mixed solders on copper substrate

Authors: Snugovsky, L.; Snugovsky, P.; Perovic, D.D.; Bagheri, S.; Rutter, J.W.

Source: Materials Science and Technology, Volume 25, Number 12, December 2009 , pp. 1467-1473(7)

Publisher: Maney Publishing

Interfacial reaction and mechanical reliability of eutectic Sn-0·7Cu/immersion Ag-plated Cu solder joint

Authors: Yoon, J.-W.; Jung, S.-B.

Source: Materials Science and Technology, Volume 25, Number 12, December 2009 , pp. 1478-1484(7)

Publisher: Maney Publishing

Thermomechanical behaviour of environmentally benign Pb-free solders

Author: Chawla, N

Source: International Materials Reviews, Volume 54, Number 6, November 2009 , pp. 368-384(17)

Publisher: Maney Publishing

Approach on Thermal Strain Behaviour of PBGA Solder Joints

Authors: Yang, Ping; Shen, Cai Jun; Liao, Ningbo

Source: Strain, Volume 45, Number 6, December 2009 , pp. 527-534(8)

Publisher: Blackwell Publishing

Preparation of Silver-Coated Glass Microsphere and Its Use

Authors: Hu, Chuanqun; Zeng, Liming; Zhou, Jiangang; Geng, Dongbing

Source: Journal of Scientific Conference Proceedings, Volume 1, Numbers 2-3, June 2009 , pp. 239-242(4)

Publisher: American Scientific Publishers

Laparoscopic Mesh Fixation Using Laser-Assisted Tissue Soldering in a Porcine Model

Authors: Lanzafame, Raymond J.; Soltz, Barbara A.; Stadler, Istvan; Soltz, Robert

Source: JSLS, Journal of the Society of Laparoendoscopic Surgeons, Volume 13, Number 3, July - September 2009 , pp. 293-301(9)

Publisher: Society of Laparoendoscopic Surgeons

Process modelling and experimentation of a cordless resistance soldering system

Authors: Lee, Jun-Tae; Li, Wei; Kim, Dave (Dae-Wook)

Source: International Journal of Manufacturing Research, Volume 4, Number 4, 18 September 2009 , pp. 428-438(11)

Publisher: Inderscience Publishers

Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites

Authors: Babaghorbani, P.; Nai, S.M.L.; Gupta, M.

Source: Materials Science and Technology, Volume 25, Number 10, October 2009 , pp. 1258-1264(7)

Publisher: Maney Publishing

'Spalling' of SAC Pb free solders when used with nickel substrates

Authors: Snugovsky, L.; Snugovsky, P.; Perovic, D.D.; Rutter, J.W.

Source: Materials Science and Technology, Volume 25, Number 10, October 2009 , pp. 1296-1300(5)

Publisher: Maney Publishing

Catalytic Behavior of Sn/Bi Metal Powder in Anhydride-Based Epoxy Curing

Authors: Jang, Keon-Soo; Eom, Yong-Sung; Moon, Jong-Tae; Oh, Yong-Soo; Nam, Jae-Do

Source: Journal of Nanoscience and Nanotechnology, Volume 9, Number 12, December 2009 , pp. 7461-7466(6)

Publisher: American Scientific Publishers

Transabdominal Preperitoneal Herniorrhaphy using Laser-Assisted Tissue Soldering in a Porcine Model

Authors: Lanzafame, Raymond J.; Soltz, Barbara A.; Stadler, Istvan; Soltz, Robert

Source: JSLS, Journal of the Society of Laparoendoscopic Surgeons, Volume 13, Number 2, April - June 2009 , pp. 190-195(6)

Publisher: Society of Laparoendoscopic Surgeons

Simulation of shape and temperature field evolution of solder joints during reflow solidification process

Authors: Chang, H.J.; Hwang, W.S.

Source: International Journal of Cast Metals Research, Volume 22, Numbers 1-4, August 2009 , pp. 131-134(4)

Publisher: Maney Publishing

Halogen-free materials with improved thermal and electrical properties

Authors: Bedner, David; He, Michael

Source: Circuit World, Volume 35, Number 3, 2009 , pp. 3-7(5)

Publisher: Emerald Group Publishing Limited

Influences on the reflow soldering process by components with specific thermal properties

Authors: Schüßler, Florian; Kozic, Denis; Franke, Jörg

Source: Circuit World, Volume 35, Number 3, 2009 , pp. 35-42(8)

Publisher: Emerald Group Publishing Limited

Chemical characterization of failures and process materials for microelectronics assembly

Authors: Huang, Chien-Yi; Li, Ming-Shu; Ku, Chen-Liang; Hsieh, Hao-Chun; Li, Kung-Cheng

Source: Microelectronics International, Volume 26, Number 3, 2009 , pp. 41-48(8)

Publisher: Emerald Group Publishing Limited

Numerical simulation approach on stress and strain for chip scale package under thermal cycling

Authors: Ping, Yang; Li, Wei

Source: International Journal of Manufacturing Technology and Management, Volume 18, Number 3, 9 June 2009 , pp. 300-307(8)

Publisher: Inderscience Publishers

Finite element analysis on stress/strain in CBGA solder joint with different substrates under thermal cycle

Authors: Ping, Yang; Shen, Caijun

Source: International Journal of Manufacturing Technology and Management, Volume 18, Number 3, 9 June 2009 , pp. 333-339(7)

Publisher: Inderscience Publishers

Effect of multiple reflow cycles on ball impact responses of Sn-Ag-Cu solder joints

Authors: Lai, Yi-Shao; Kao, C.R.; Chang, Hsiao-Chuan; Kao, Chin-Li

Source: Soldering & Surface Mount Technology, Volume 21, Number 3, 2009 , pp. 4-9(6)

Publisher: Emerald Group Publishing Limited

Reliability analysis of a novel fan-out type WLP

Authors: Yew, Ming-Chih; Tsai, Mars; Hu, Dyi-Chung; Yang, Wen-Kun; Chiang, Kuo-Ning

Source: Soldering & Surface Mount Technology, Volume 21, Number 3, 2009 , pp. 30-38(9)

Publisher: Emerald Group Publishing Limited

Thermal contact at solder/substrate interfaces during solidification

Authors: Nyamannavar, S.; Prabhu, K.N.

Source: Materials Science and Technology, Volume 25, Number 6, June 2009 , pp. 707-710(4)

Publisher: Maney Publishing