Search Results

High aspect ratio "multiple wire" microvias in flexible PCBs

Authors: Lindeberg, Mikael; Hjort, Klas

Source: Circuit World, Volume 35, Number 4, 2009 , pp. 18-21(4)

Publisher: Emerald Group Publishing Limited

Electroless copper plating and surface characterization of thermoplastic PPO based printed circuit boards

Authors: Laine-Ma, Teija; Ruuskanen, Pekka; Kortet, Satu; Karttunen, Mikko

Source: Circuit World, Volume 35, Number 4, 2009 , pp. 22-30(9)

Publisher: Emerald Group Publishing Limited

Fabrication of Nanoscale Nozzle for Electrohydrodynamic (EHD) Inkjet Head and High Precision Patterning by Drop-on-Demand Operation

Authors: Nguyen, Vu Dat; Schrlau, Michael G.; Tran, Si Bui Quang; Bau, Haim H.; Ko, Han Seo; Byun, Doyoung

Source: Journal of Nanoscience and Nanotechnology, Volume 9, Number 12, December 2009 , pp. 7298-7302(5)

Publisher: American Scientific Publishers

Extraction of DC busbar parasitics in PWM inverters

Authors: Çay, Zarife; Henze, Olaf; Weiland, Thomas

Source: COMPEL: Int J for Computation and Maths. in Electrical and Electronic Eng., Volume 28, Number 4, 2009 , pp. 1033-1043(11)

Publisher: Emerald Group Publishing Limited

EnFACE: a maskless process for circuit fabrication

Author: Roy, Sudipta

Source: Circuit World, Volume 35, Number 3, 2009 , pp. 8-11(4)

Publisher: Emerald Group Publishing Limited

Microfluidic systems on a printed wiring board platform

Authors: Lian, Keryn; O'Rourke, Shawn; Sadler, Daniel; Gamboa, Claudia; Terbrueggen, Robert; Chason, Marc

Source: Circuit World, Volume 35, Number 3, 2009 , pp. 12-20(9)

Publisher: Emerald Group Publishing Limited

The processing time optimization of printed circuit board

Author: Ancau, Mircea

Source: Circuit World, Volume 35, Number 3, 2009 , pp. 21-28(8)

Publisher: Emerald Group Publishing Limited

Method and system of automated measurement of micro drill bit wear

Authors: Fu, Lianyu; Li, Jian; Yang, Fan

Source: Circuit World, Volume 35, Number 3, 2009 , pp. 29-34(6)

Publisher: Emerald Group Publishing Limited

Influences on the reflow soldering process by components with specific thermal properties

Authors: Schüßler, Florian; Kozic, Denis; Franke, Jörg

Source: Circuit World, Volume 35, Number 3, 2009 , pp. 35-42(8)

Publisher: Emerald Group Publishing Limited

Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF)

Authors: Lee, Jong-Bum; Koo, Ja-Myeong; Kim, Jong-Woong; Noh, Bo-In; Lee, Jong-Gun; Jung, Seung-Boo

Source: Journal of Adhesion, Volume 85, Number 6, June 2009 , pp. 341-350(10)

Publisher: Taylor and Francis Ltd

The skill requirements of CAD/CAM: an exploratory study

Author: Adler, Paul S.

Source: International Journal of Technology Management, Volume 5, Number 2, 25 May 2009 , pp. 201-216(16)

Publisher: Inderscience Publishers

Cracking phenomena on flexible-rigid interfaces in PCBs under thermo cycling loading

Authors: Arruda, Luciano; Bonadiman, Renato; Costa, Josineto; Reinikainen, Tommi

Source: Circuit World, Volume 35, Number 2, 2009 , pp. 18-22(5)

Publisher: Emerald Group Publishing Limited

Reflow ageing influences and wettability effects of immersion tin final finishes with lead-free solder

Authors: Hetschel, Thomas; Wolter, Klaus-Jürgen; Phillipp, Fritz

Source: Circuit World, Volume 35, Number 2, 2009 , pp. 37-44(8)

Publisher: Emerald Group Publishing Limited

Microvia fill process control

Authors: Tenno, R.; Pohjoranta, A.

Source: International Journal of Control, Volume 82, Number 5, May 2009 , pp. 883-893(11)

Publisher: Taylor and Francis Ltd

FROTH FLOTATION FOR BENEFICIATION OF PRINTED CIRCUIT BOARDS COMMINUTION FINES: AN OVERVIEW

Authors: Ogunniyi, I. O.; Vermaak, M. K. G.

Source: Mineral Processing and Extractive Metallurgy Review, Volume 30, Number 2, April 2009 , pp. 101-121(21)

Publisher: Taylor and Francis Ltd

Ultrasonic bonding of flexible PCB to rigid PCB using an Sn interlayer

Authors: Kim, Kyoo-Seok; Jung, Jae-Pil; Zhou, Y. Norman

Source: Soldering & Surface Mount Technology, Volume 21, Number 1, 2009 , pp. 4-10(7)

Publisher: Emerald Group Publishing Limited

Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed-circuit boards

Authors: Lee, J.; Cho, C.; Morris, J.

Source: Microsystem Technologies, Volume 15, Number 1, January 2009 , pp. 145-149(5)

Publisher: Springer

Non-referential, self-compared shape defect inspection for bond pads with deformed shapes

Authors: Tsai, Du-Ming; Su, Yan-Jheng

Source: International Journal of Production Research, Volume 47, Number 5, January 2009 , pp. 1225-1244(20)

Publisher: Taylor and Francis Ltd

Organizational context and knowledge transfer of a high-tech MNC: A balanced approach to successful European-Asian cooperation

Authors: Kasper, Helmut; Mühlbacher, Jürgen

Source: Chinese Management Studies, Volume 2, Number 2, 2008 , pp. 153-163(11)

Publisher: Emerald Group Publishing Limited

Detection of Banned and Restricted Ozone-Depleting Chemicals in Printed Circuit Boards

Authors: Lee, Richard; Wright, Bob

Source: Environmental Forensics, Volume 9, Number 4, October 2008 , pp. 320-339(20)

Publisher: Taylor and Francis Ltd