Search Results

Reliability testing for microvias in printed wire boards

Author: Birch, Bill

Source: Circuit World, Volume 35, Number 4, 2009 , pp. 3-17(15)

Publisher: Emerald Group Publishing Limited

High aspect ratio "multiple wire" microvias in flexible PCBs

Authors: Lindeberg, Mikael; Hjort, Klas

Source: Circuit World, Volume 35, Number 4, 2009 , pp. 18-21(4)

Publisher: Emerald Group Publishing Limited

Influences on the reflow soldering process by components with specific thermal properties

Authors: Schüßler, Florian; Kozic, Denis; Franke, Jörg

Source: Circuit World, Volume 35, Number 3, 2009 , pp. 35-42(8)

Publisher: Emerald Group Publishing Limited

Reliability of PWB microvias for high density package assembly

Author: Ghaffarian, Reza

Source: International Journal of Materials and Structural Integrity, Volume 2, Numbers 1-2, 21 June 2008 , pp. 47-63(17)

Publisher: Inderscience Publishers

Challenges in the manufacture of glass substrates for electrical and optical interconnect

Authors: Hutt, David A.; Williams, Karen; Conway, Paul P.; Khoshnaw, Fuad M.; Cui, Xiaoyun; Bhatt, Deepa

Source: Circuit World, Volume 33, Number 1, 2007 , pp. 22-30(9)

Publisher: Emerald Group Publishing Limited

Interconnect microvia drilling with a radially polarized laser beam

Authors: Venkatakrishnan, Krishnan; Tan, Bo

Source: Journal of Micromechanics and Microengineering, Volume 16, Number 12, December 2006 , pp. 2603-2607(5)

Publisher: Institute of Physics Publishing

Modelling of microvia drilling with a Nd : YAG laser

Authors: Zhang, C.; Salama, I.A.; Quick, N.R.; Kar, A.

Source: Journal of Physics D: Applied Physics, Volume 39, Number 17, 7 September 2006 , pp. 3910-3918(9)

Publisher: Institute of Physics Publishing

Effect of SnAgCu composition on soldering performance

Authors: Huang, Benlih; Dasgupta, Arnab; Lee, Ning-Cheng

Source: Soldering & Surface Mount Technology, Volume 17, Number 3, 2005 , pp. 9-19(11)

Publisher: Emerald Group Publishing Limited

A comprehensive study of ion track enabled high aspect ratio microstructures in flexible circuit boards

Authors: Lindeberg, M.; Hjort, K.

Source: Microsystem Technologies, Volume 10, Numbers 8-9, November 2004 , pp. 608-621(14)

Publisher: Springer

The effect of waveform for pulse plating on copper plating distribution of microvia in PCB manufacture

Authors: Yung, K.; Chan, K.; Yue, T.; Yeung, K.

Source: The International Journal of Advanced Manufacturing Technology, Volume 23, Numbers 3-4, February 2004 , pp. 245-248(4)

Publisher: Springer

A study of microvias produced by laser-assisted seeding mechanism in blind via hole plating of printed circuit board

Authors: Leung, E.S.W.; Yung, W.K.C.; Lee, W.B.

Source: The International Journal of Advanced Manufacturing Technology, Volume 24, Numbers 7-8, October 2004 , pp. 474-484(11)

Publisher: Springer

An innovative "ChemicalVia" process for the production of high density interconnect printed circuit boards

Authors: Vitor da Silva; Rui de Oliveira; David Watts; Erik van der Bij

Source: Circuit World, Volume 30, Number 4, 2004 , pp. 27-33(7)

Publisher: Emerald Group Publishing Limited

Enhanced reliability of high-density wiring (HDW) substrates through new base substrate and dielectric materials

Authors: Hegde S.; Pucha R.V.; Sitaraman S.K.

Source: Journal of Materials Science: Materials in Electronics, Volume 15, Number 5, May 2004 , pp. 287-296(10)

Publisher: Springer

Copper electroplating technology for microvia filling

Authors: Lefebvre, Mark; Allardyce, George; Seita, Masaru; Tsuchida, Hideki; Kusaka, Masaru; Hayashi, Shinjiro

Source: Circuit World, Volume 29, Number 2, 2003 , pp. 9-14(6)

Publisher: Emerald Group Publishing Limited

Embedded passive technology for networking systems

Authors: Jones G.D.; Lauffer J.

Source: Circuit World, Volume 28, Number 4, 2002 , pp. 26-32(7)

Publisher: Emerald Group Publishing Limited

Imprint patterning: a novel method for producing high density interconnects

Author: Gregoire G.

Source: Circuit World, Volume 28, Number 4, 2002 , pp. 33-37(5)

Publisher: Emerald Group Publishing Limited

Microvias effect on high-frequency signal integrity

Author: Holden H.

Source: Circuit World, Volume 28, Number 3, 2002 , pp. 10-21(12)

Publisher: Emerald Group Publishing Limited

Analysis and comparison of WLCSP-on-build-up PCB assemblies with various solders and microvia configurations

Authors: Lee, S.-W. Ricky; Lau, John H.

Source: Circuit World, Volume 28, Number 2, 2002 , pp. 32-38(7)

Publisher: Emerald Group Publishing Limited

Horizontal processing for metallizing microvias

Authors: Gebhardt J.; Waryold K.; Oglesby D.; Graves J.

Source: Circuit World, Volume 28, Number 1, 2002 , pp. 34-39(6)

Publisher: Emerald Group Publishing Limited

Horizontal processing for metallizing microvias

Authors: Gebhardt J.; Waryold K.; Oglesby D.; Graves J.

Source: Circuit World, Volume 28, Number 1, 2001 , pp. 34-39(6)

Publisher: Emerald Group Publishing Limited