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The Role of TiO₂ in Ceramic Bulk Interference Suppressing Resistor Integrated with Car Spark Plug

Authors: Klimiec, Ewa; Nowak, Stanisław; Zaraska, Wiesław; Stoch, Jerzy

Source: Journal of Electronic Materials, Volume 36, Number 7, July 2007 , pp. 798-804(7)

Publisher: Springer

A novel architecture of a tunable bandpass BAW-filter for a WCDMA transceiver

Authors: Razafimandimby, Stéphane; Tilhac, Cyrille; Cathelin, Andreia; Kaiser, Andreas; Belot, Didier

Source: Analog Integrated Circuits and Signal Processing, Volume 49, Number 3, December 2006 , pp. 237-247(11)

Publisher: Springer

Temperature-Aware Floorplanning of 3-D ICs Considering Thermally Dependent Leakage Power

Authors: Deng, Yangdong; Li, Peng

Source: Journal of Low Power Electronics, Volume 2, Number 2, August 2006 , pp. 177-188(12)

Publisher: American Scientific Publishers

Thermal distribution calculations for block level placement in embedded systems

Authors: Patrikar R.M.; Murali K.; Ping L.E.

Source: Microelectronics Reliability, Volume 44, Number 1, January 2004 , pp. 129-134(6)

Publisher: Elsevier

Ka-band InP high electron mobility transistor monolithic microwave integrated circuit reliability

Authors: Paine B.M.; Wong R.C.; Schmitz A.E.; Walden R.H.; Nguyen L.D.; Delaney M.J.; Hum K.C.

Source: Microelectronics Reliability, Volume 41, Number 8, August 2001 , pp. 1115-1122(8)

Publisher: Elsevier

Comparison of silicon pin diode detector fabrication processes using ion implantation and thermal doping

Authors: Zhou C.Z.; Warburton W.K.

Source: Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, Volume 378, Number 3, 21 August 1996 , pp. 529-530(2)

Publisher: Elsevier