Printed Circuit Board Encapsulation and Integration of High-Speed Polymer Photodiodes
We present the encapsulation and integration of polymer photodiodes based on a bulk-heterojunction of regioregular poly(3-hexylthiophene-2,5-diyl) (P3HT) and [6,6]-phenyl-C61-butyric acid methyl ester (PCBM) using a printed circuit board (PCB) with a capillary underfill technique. Fall times below 250 ns are achieved. High-speed PCB encapsulated organic devices could provide cost effective solutions for lab-on-a-chip systems or optical interconnects.
Keywords: ENCAPSULATION; HIGH FREQUENCY; INTEGRATION; LAB ON CHIP; ORGANIC PHOTODETECTOR; PHOTODIODE; PRINTED CIRCUIT BOARD
Document Type: Research Article
Publication date: 01 June 2010
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