P + Structural Layers for Microelectromechanical Systems Using Spin-on Dopants
Simple, low cost means of prototyping new sensor technology is the key to rapid development in research facilities. A commonly available spin-on boron source is proposed for use in p + etch stop processing with ethylenediamine pyrocatechol (EDP)wet etchant. This cost-effective method
utilizes a 2.0% boron liquid source processed in a quartz tube furnace. Concentrations up to 2 × 1020 cm–3 have been achieved and displayed characteristic concentration dependent profiles, i.e.deeper than predicted by simple predepo- sition models using the
complementary error function (erfc). Results were quantified for samples diffused for one, two and four hours. Sheet resistance decreased from 5.3 Ω /sq to 2.7 Ω /sq while junction depth increased from 2.3 μ m to 5.4 μ m for one and four hour diffusions, respectively. This
method proved capable of producing released structures (x
r) up to 2.8 μm thick. The depth of the suspended structures versus diffusion time is presented and a 53% release ratio (xr/xj
) is introduced to predict results within the four-hour diffusion
duration.
Keywords: MICROELECTROMECHANICAL SYSTEMS (MEMS); P + ETCH STOP; SPIN-ON DOPANT
Document Type: Research Article
Publication date: 01 September 2004
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