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Effect of Lead-Free Frit on Conductivity of Nanoparticles-Aided Silver Paste

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Silver thick films were prepared from lead-free silver paste adding silver nanoparticles for low sintering temperature, and the effect of glass frit content on conductivity in the films was investigated. Silver pastes with different glass contents were prepared by mixing micron-scale silver powder of 1.6 μm and nanoparticles of 30–50 nm in size. To prepare lead-free silver paste, 5 wt% of the silver nanoparticles as a sintering aid were added to the micron-scale silver powder. Then, 3 wt%, 6 wt%, and 9 wt% of lead-free frits were added to the mixed powders. Using the paste, thick films were prepared by a screen printing on an alumina substrate and then the films were sintered at temperatures from 300 °C to 550 °C. As increasing the sintering temperature and content of lead-free frit, the thick films showed dense microstructure. The glass frit enhanced to develop denser microstructure by liquid phase sintering. However, excess of glass content increased sheet resistivity due to the formation of glass pool separated from particle network. Furthermore, the nanoparticles can assist to develop a conductive network in the film. The films with 6 wt% of glass frit had the best conductive network and the lowest sheet resistivity of 3.2 μΩ cm.
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Keywords: LEAD-FREE; NANOPARTICLES; SHEET RESISTIVITY; SILVER PASTE

Document Type: Research Article

Publication date: 01 October 2008

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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