Durability Improvement of Co-cured Carbon/Epoxy Composite-Aluminum Laminate With Nano-size Carbon Black at Cryogenic Temperature
Authors: Lee, Kwan Ho1; Kim, Byoung Jung1; Yoon, Soon Ho1; Lee, Dai Gil2
Source: Journal of Adhesion Science and Technology, Volume 23, Number 4, 2009 , pp. 639-649(11)
Publisher: VSP, an imprint of Brill
Abstract:
Since metal foils such as aluminum, copper or nickel foils have been used in composite structures for radiation shielding and EMI protection in space environments, high adhesive bonding strength and durability between metal foils and composites under large temperature variations are very important. In this study, the strength of co-cure bonded joint between an aluminum foil and a composite has been investigated, with three different aluminum surface treatments such as standard PAA (Phosphoric Acid Anodization) procedure, abrasion with sandpaper, and carbon black pasting on the metal foils. From the double cantilever beam (DCB) tests, it was found that the interlaminar peel strength with carbon black pasting improved 60% compared to the laminate without any surface treatment. Also it was found that the interlaminar peel strength of the co-cure carbon/epoxy composite-aluminum foil hybrid laminate with the carbon black pasting on the aluminum foil did not decrease after many thermal cycles from 30°C to -196°C.Keywords: SPACE; LAMINATE; INTERLAMINAR PEEL STRENGTH; THERMAL CYCLE; NANO-SIZE CARBON BLACK
Document Type: Research article
DOI: http://dx.doi.org/10.1163/156856108X379146
Affiliations: 1: Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, ME5202, Guseong-dong, Yuseong-gu, Daejeon 305-701, Republic of Korea 2: Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, ME5202, Guseong-dong, Yuseong-gu, Daejeon 305-701, Republic of Korea;, Email: dglee@kaist.ac.kr
Publication date: 2009-02-01
- In this: publication
- By this: publisher
- In this Subject: Chemistry (General) , Engineering/Technology , Materials & Manufacturing
- By this author: Lee, Kwan Ho ; Kim, Byoung Jung ; Yoon, Soon Ho ; Lee, Dai Gil

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